Solder Paste in Electronics Packaging Technology and Applications in Surface Mount, Hybrid Circuits and Component Assembly by Jennie S. Hwang
  

Solder Paste in Electronics Packaging Technology and Applications in Surface Mount, Hybrid Circuits and Component Assembly

Written by Jennie S. Hwang
Illustrated by

Synopsis

Solder Paste in Electronics Packaging Technology and Applications in Surface Mount, Hybrid Circuits and Component Assembly by Jennie S. Hwang

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo- dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation- ships between these characteristics are clearly explained and pre- sented. In this excellent presentation, Dr. Hwang highlights three impor- tant areas of solder paste technology.

About the Author

Other Formats

Book Info

Format

Hardback
456 pages

Author

Jennie S. Hwang
More books by Jennie S. Hwang

Publisher

Kluwer Academic Publishers an imprint of Kluwer Academic Publishers Group

Publication date

1st April 1989

ISBN

9780442207540


Love “Lovereading4kids” as my son gets to hear about & read new books before his mates which keeps him interested in reading=a very happy Mum

Liz Evans

I have told all my friends, family & teachers to see for themselves just how great the site is. Without fail, they are hugely impressed.

Alexander Boxall – age 11

LoveReading4Kids is a modern and creative way of emphasising the value and importance of books in this digital age #booksforlife

Amrit Bunet – Teen

It is THE website to use for narrowing down your search for any book. Definitely knocks the socks off any other book review website.

Nickey and Tomasz Hawryszczuk

I love finding new books to read. My mummy and me look at the new ones coming out. I have written reviews of some of them!

Jessica Cobbin – age 7

I love all the books they recommend & put up for me to review. I also love the fact that they give new authors the chance to share their boo

Daisy Pennock – age 15

We love Lovereading as my 5 year old loves to read new books before anyone else has a chance, she says it makes reading exciting!

Tracey Chorley

I think Lovereading4kids is an amazing company because of the friendly staff and the fabulous chance to read great books before publication.

Adam Graham
Lovereading

Lovereading 4 schools
****